Coated glazing

ABSTRACT

A coated glazing comprising: a transparent glass substrate, wherein a surface of the substrate is directly or indirectly coated with at least one layer based on a transparent conductive coating (TCC) and/or at least one layer based on a material with a refractive index of at least 1.75, and wherein said surface has an arithmetical mean height of the surface value, Sa, of at least 0.4 nm prior to said coating of said surface.

This invention relates to a coated glazing, a method of manufacture ofsaid glazing and the use of an acidic gas to increase the haze (lightscattering) exhibited by a coated glazing.

There is currently significant interest in devices such as photovoltaic(PV) modules, light emitting diodes (LEDs) and organic light emittingdiodes (OLEDs). There is also considerable attention given to glass forhorticulture. Manufacturers of these devices and glazings aim tomanipulate light in a number of different ways.

Photovoltaic (PV) modules or solar cells are material junction deviceswhich convert sunlight into direct current (DC) electrical power. Whenexposed to sunlight (consisting of energy from photons), the electricfield of PV module p-n junctions separates pairs of free electrons andholes, thus generating a photo-voltage. A circuit from n-side to p-sideallows the flow of electrons when the PV module is connected to anelectrical load, while the area and other parameters of the PV modulejunction determine the available current. Electrical power is theproduct of the voltage times the current generated as the electrons andholes recombine.

It is to be understood that in the context of the present invention theterm “PV module” includes any assembly of components generating theproduction of an electric current between its electrodes by conversionof solar radiation, whatever the dimensions of the assembly, the voltageand the intensity of the produced current, and whether or not thisassembly of components presents one or more internal electricalconnection(s) (in series and/or parallel). The term “PV module” withinthe meaning of the present invention is thus here equivalent to“photovoltaic device” or “photovoltaic panel”, as well as “photovoltaiccell”.

PV modules rely on substances known as semiconductors. Semiconductorsare insulators in their pure form, but are able to conduct electricitywhen heated or combined with other materials. A semiconductor mixed, or“doped”, for example with phosphorous develops an excess of freeelectrons. This is known as an n-type semiconductor. A semiconductordoped with other materials, such as boron, develops an excess of“holes,” spaces that accept electrons. This is known as a p-typesemiconductor.

A PV module joins n-type and p-type materials, with a layer in betweenknown as a junction. Even in the absence of light, a small number ofelectrons move across the junction from the n-type to the p-typesemiconductor, producing a small voltage. In the presence of light,photons dislodge a large number of electrons, which flow across thejunction to create a current which can be used to power electricaldevices.

Traditional PV modules use silicon in the n-type and p-type layers. Thenewest generation of thin-film PV module uses thin layers of cadmiumtelluride (CdTe), amorphous or microcrystalline silicon, or copperindium gallium deselenide (CIGS) instead.

The semiconductor junctions are formed in different ways, either as ap-i-n device in amorphous silicon (a-Si), or as a hetero-junction (e.g.with a thin cadmium sulphide layer that allows most sunlight to passthrough) for CdTe and CIGS. In their simplest form, a-Si cells sufferfrom significant degradation in their power output (in the range 15-35%)when exposed to the sun. Better stability requires the use of thinnerlayers, however, this reduces light absorption and hence cellefficiency. This has led the industry to develop tandem and even triplelayer devices that contain p-i-n cells stacked on top of each other.

Generally a transparent conductive oxide (TCO) layer forms the frontelectrical contact of the cell, and a metal layer forms the rearcontact. The TCO may be based on doped zinc oxide (e.g. ZnO:Al [ZAO] orZnO:B), tin oxide doped with fluorine (SnO₂:F) or an oxide material ofindium and tin (ITO). These materials are deposited chemically, such asfor example by chemical vapour deposition (“CVD”), or physically, suchas for example by vacuum deposition by magnetron sputtering.

For PV modules it can be advantageous to scatter the light that entersthe module in order to improve its quantum efficiency. With respect tothin film silicon PV modules, it would be useful to increase the angleof scatter, and hence improve the trapping of weakly absorbed longwavelength light in the module.

LEDs are forward-biased p-n junction diodes made of semiconductormaterials. A depletion region forms spontaneously across a p-n junctionand prevents electrons and holes from recombining. When the p-n junctionis forward-biased (switched on) with a sufficient voltage, the depletionregion is narrowed and electrons can overcome the resistivity of thedepletion region to cross the p-n junction into the p-type region wherethe recombination of electron-hole pairs causes the release of energyvia the emission of light. This effect is called electroluminescence andthe colour of the light is determined by the energy gap of thesemiconductor. It is to be understood that in the context of the presentinvention the term “LED” includes any assembly of components thatutilises a diode of semiconductor material that emits light when aforward bias is applied.

Early LED devices emitted low-intensity red light, but modern LEDs areavailable across the visible, ultraviolet and infra red wavelengths,with very high brightness. LEDs present many advantages over traditionallight sources including lower energy consumption, longer lifetime,improved robustness, smaller size and faster switching. However, theyare relatively expensive and require more precise current and heatmanagement than traditional light sources. Applications of LEDs arediverse. They are used as low-energy indicators but also forreplacements for traditional light sources in general lighting andautomotive lighting. The compact size of LEDs has allowed new text andvideo displays and sensors to be developed, while their high switchingrates are useful in communications technology.

OLEDs are LEDs in which the emissive electroluminescent layer(s) is afilm of or based mainly on organic materials which emit light inresponse to an electric current. The organic molecules are electricallyconductive as a result of delocalization of pi electrons caused byconjugation over all or part of the molecule. This layer of organicsemiconductor material is situated between two electrodes in some cases.Generally, at least one of these electrodes is transparent. It is to beunderstood that in the context of the present invention the term “OLED”includes any assembly of components that utilises a diode of organicsemiconductor material that emits light when a forward bias is applied.OLEDs can be used in television screens, computer monitors, small orportable system screens such as those found on mobile phones and thelike.

A typical OLED comprises at least two organic layers, e.g. a conductivelayer and an emissive layer, that are embedded between two electrodes.One electrode typically is made of a reflective metal. The otherelectrode typically is a transparent conductive coating (TCC) supportedby a glass substrate. Indium tin oxide (ITO) is often used at the frontportion of the OLED as the anode.

During operation, a voltage is applied across the OLED such that theanode is positive with respect to the cathode. A current of electronsflows through the device from cathode to anode and electrostatic forcesbring the electrons and the holes towards each other and they recombinecloser to the emissive layer resulting in the emission of radiationwhose frequency is in the visible region.

LEDs and OLEDs are typically fabricated by providing a transparentconducting electrode comprising a transparent substrate and a conductivecoating stack, and building successive layers thereon comprising theactive region of the device and a further electrode—which may also betransparent. The transparent conducting electrode is frequently realisedby depositing the conductive stack of coatings on the substrate usingtechniques such as CVD. The conductive stack typically comprises a TCC,such as a TCO, e.g. a doped metal oxide, as the uppermost layer (i.e.the furthest layer from the substrate). In addition to offering therequisite electrical properties and mechanical stability, the TCO shouldoffer a suitable surface for deposition of further layers as the rest ofthe device is fabricated.

For LEDs and OLEDs the emphasis is clearly on extracting the light fromthe device such that it can serve its purpose rather than merely heatingthe device. Edge-lit LED luminaires, for instance, could benefit fromlight outcoupling (the escape of photons from an LED) by increasinglight scattering. The extraction of light from OLED panels has hithertogenerally been enhanced by the use of an external light extraction filme.g. on the external surface of a transparent substrate. It would be asignificant breakthrough for OLED manufacture to provide an integratedsubstrate that combines an internal light extraction structure and aTCC.

Glazings for use in horticulture, e.g. in greenhouses, preferablytransmit diffuse light and therefore glazings that can scatter light areof interest in this field.

According to a first aspect of the present invention there is provided acoated glazing comprising:

a transparent glass substrate,

wherein a surface of the substrate is directly or indirectly coated withat least one layer based on a transparent conductive coating (TCC)and/or at least one layer based on a material with a refractive index ofat least 1.75, and

wherein said surface has an arithmetical mean height of the surfacevalue, Sa, of at least 0.4 nm prior to said coating of said surface.

It has surprisingly been found that the coated glazing of the presentinvention exhibits light scattering such that its use in LEDs and OLEDscan afford improved light extraction. Furthermore, these coated glazingsare also applicable to PV modules in order to promote the trapping oflight to boost efficiency. The light scattering properties of thesecoated glazings can additionally be exploited in horticulturalapplications.

In the following discussion of the invention, unless stated to thecontrary, the disclosure of alternative values for the upper or lowerlimit of the permitted range of a parameter, coupled with an indicationthat one of said values is more highly preferred than the other, is tobe construed as an implied statement that each intermediate value ofsaid parameter, lying between the more preferred and the less preferredof said alternatives, is itself preferred to said less preferred valueand also to each value lying between said less preferred value and saidintermediate value.

In the context of the present invention, where a layer is said to be“based on” a particular material or materials, this means that the layerpredominantly consists of the corresponding said material or materials,which means typically that it comprises at least about 50 at. % of saidmaterial or materials.

Preferably said surface has an arithmetical mean height of the surfacevalue, Sa, of at least 0.6 nm, more preferably at least 0.8 nm, evenmore preferably at least 1.0 nm, even more preferably at least 1.5 nm,most preferably at least 3 nm, prior to said at least partial coating ofsaid surface. Preferably said surface has an Sa value of at most 25 nm,more preferably at most 20 nm, even more preferably at most 15 nm, mostpreferably at most 10 nm, prior to said coating of said surface. Sagives an indication of the roughness of a surface. A rougher surfaceleads to a glazing that exhibits more light scattering and is thereforeuseful in a number of applications as detailed above. However, therougher a surface is, the more challenging it is to deposit layers inorder to provide a working PV, LED or OLED device, since a roughersurface is more likely to cause electrical shorts, which affect deviceperformance.

Preferably said surface, to a depth of 100 nm, has a porosity of atleast 0.2, more preferably at least 0.3, even more preferably at least0.4, most preferably at least 0.5, but preferably at most 0.95, morepreferably at most 0.9, even more preferably at most 0.8, mostpreferably at most 0.7. Said porosity may be prior to said coating ofsaid surface. In the context of the present invention porosity or voidfraction is a measure of the void (i.e., “empty”) spaces in a material,and is a fraction of the volume of voids over the total volume, between0 and 1. A more porous surface leads to a glazing that exhibits morelight scattering and is therefore useful in a number of applications asdetailed above.

Preferably said glazing exhibits a haze of at least 0.4%, morepreferably at least 0.5%, even more preferably at least 0.6%, mostpreferably at least 0.7%, but preferably at most 4.0%, more preferablyat most 3.0%, even more preferably at most 2.0%, most preferably at most1.5%. The haze values are to be measured in accordance with the ASTM D1003-61 standard. Glazings with these preferred haze values are usefulin a number of applications as detailed above.

Preferably the surface is completely coated with at least one layerbased on a TCC and/or at least one layer based on a material with arefractive index of at least 1.75.

Preferably the TCC is a transparent conductive oxide (TCO). Preferablythe TCO is one or more of fluorine doped tin oxide (SnO₂:F), zinc oxidedoped with aluminium, gallium or boron (ZnO:Al, ZnO:Ga, ZnO:B), indiumoxide doped with tin (ITO), cadmium stannate, ITO:ZnO, ITO: Ti, In₂O₃,In₂O₃—ZnO (IZO), In₂O₃:Ti, In₂O₃:Mo, In₂O₃:Ga, In₂O₃:W, In₂O₃:Zr,In₂O₃:Nb, In_(2-2x)M_(x)Sn_(x)O₃ with M being Zn or Cu, ZnO:F,Zn_(0.9)Mg_(0.1)O:Ga, and (Zn,Mg)O:P, ITO:Fe, SnO₂:Co, In₂O₃:Ni,In₂O₃:(Sn,Ni), ZnO:Mn, and ZnO:Co.

Preferably each layer of the at least one layer based on a TCC has athickness of at least 20 nm, more preferably at least 100 nm, even morepreferably at least 200 nm, most preferably at least 300 nm; butpreferably at most 550 nm, more preferably at most 450 nm, even morepreferably at most 370 nm, most preferably at most 350 nm. Thesethicknesses are preferred in order to strike a balance between theproperties of 1) conductivity 2) absorption (the thicker the layer themore absorption and the lower the transmission) and 3) coloursuppression (certain thicknesses are better for obtaining a neutralcolour).

Preferably the material with a refractive index of at least 1.75 has arefractive index of at least 1.8, more preferably at least 1.9, evenmore preferably at least 2.0, but preferably at most 4.5, morepreferably at most 3.5, even more preferably at most 3.0. Preferably thematerial with a refractive index of at least 1.75 is one or more ofSnO₂, TiO₂, and ZnO. Materials with these refractive indexes have beenfound to amplify the light scattering exhibited by the resultant coatedglazings.

Preferably each layer of the at least one layer based on a material witha refractive index of at least 1.75 has a thickness of at least 10 nm,more preferably at least 50 nm, even more preferably at least 100 nm,most preferably at least 120 nm; but preferably at most 250 nm, morepreferably at most 200 nm, even more preferably at most 170 nm, mostpreferably at most 150 nm. These preferred thicknesses provide thedesired light scattering amplification whilst avoiding excessiveabsorption.

Preferably the glazing further comprises at least one layer based on anoxide of a metal or of a metalloid, such as SiO₂, SnO₂, TiO₂, siliconoxynitride and/or aluminium oxide. One layer of said at least one layerbased on an oxide of a metal or of a metalloid is preferably located indirect contact with said surface of the glass substrate. Additionally,or alternatively, one layer of said at least one layer based on an oxideof a metal or of a metalloid is preferably located in direct contactwith the layer based on a TCC or the layer based on a material with arefractive index of at least 1.75. Such a layer based on an oxide of ametal or of a metalloid may act as a blocking layer to prevent thediffusion of sodium ions to the surface, which can be a source ofcorrosion, or it may act as a colour suppression layer to suppressiridescent reflection colours resulting from variations in thickness ofthe layers.

Preferably each layer of the at least one layer based on an oxide of ametal or of a metalloid has a thickness of at least 5 nm, morepreferably at least 10 nm, even more preferably at least 15 nm, mostpreferably at least 20 nm; but preferably at most 100 nm, morepreferably at most 50 nm, even more preferably at most 40 nm, mostpreferably at most 30 nm.

The glazing may further comprise one or more additional layers toeffectively planarise the surface to assist with the subsequentdeposition of layers to form e.g. PV, LED or OLED devices. Manufacturersof such devices may need to consider the planarity of the surface of thecoated glazing in their material selection.

The glass substrate may directly contact the layer based on a TCC or thelayer based on a material with a refractive index of at least 1.75. Whenboth the layer based on a TCC and the layer based on a material with arefractive index of at least 1.75 are present, preferably the layerbased on a TCC directly contacts the layer based on a material with arefractive index of at least 1.75 such that there are no interveninglayers.

In some embodiments the surface is coated with a layer based on a TCCand a layer based on a material with a refractive index of at least1.75. Preferably the layer based on a material with a refractive indexof at least 1.75 is located nearer to the glass substrate than the layerbased on a TCC.

Heat treated glass panes which are toughened to impart safety propertiesand/or are bent are required for a large number of areas of application.It is known that for thermally toughening and/or bending glass panes itis necessary to process the glass panes by a heat treatment attemperatures near or above the softening point of the glass used andthen either to toughen them by rapid cooling or to bend them with theaid of bending means. The relevant temperature range for standard floatglass of the soda lime silica type is typically about 580-690 ° C., theglass panes being kept in this temperature range for several minutesbefore initiating the actual toughening and/or bending process.

“Heat treatment”, “heat treated” and “heat treatable” in the followingdescription and in the claims refer to thermal bending and/or tougheningprocesses such as mentioned before and to other thermal processes duringwhich a coated glass pane reaches temperatures in the range of about580-690 ° C. for a period of several minutes, e.g., for about 5 minutes,preferably for about 10 minutes. A coated glass pane is deemed to beheat treatable if it survives a heat treatment without significantdamage, typical damages caused by heat treatments being high hazevalues, pinholes or spots. Preferably the coated glazing according tothe present invention is heat treatable.

Preferably the glass substrate is a soda lime silica or borosilicateglass substrate.

According to a second aspect of the present invention there is provideda method of manufacture of a coated glazing comprising the followingsteps in sequence:

a) providing a transparent glass substrate,

b) etching a surface of the substrate with an acidic gas,

c) directly or indirectly coating said surface with at least one layerbased on a transparent conductive coating (TCC) and/or at least onelayer based on a material with a refractive index of at least 1.75.

It has surprisingly been found that by acid etching a surface of a glasssubstrate and subsequently coating said surface with a layer based on atransparent conductive coating (TCC) and/or a layer based on a materialwith a refractive index of at least 1.75 that a coated glazing withbeneficial light scattering properties can be obtained. Such a glazingcan be used in LEDs and OLEDs to improve light extraction, in PV modulesto promote the trapping of light to boost efficiency, and inhorticultural applications where the transmission of diffuse light isfavoured.

Preferably step b) is carried out using Chemical Vapour Deposition(CVD). Both steps b) and c) may be carried out using CVD. Alternatively,when said surface is to be coated with both a layer based on a TCC and alayer based on a material with a refractive index of at least 1.75, thefirst of said layers that is deposited on said surface may be depositedusing CVD and at least one of the subsequently deposited layers may bedeposited using physical vapour deposition (PVD).

Step c) may further comprise directly or indirectly coating said surfaceof the glass substrate with at least one layer based on an oxide of ametal or of a metalloid, as set out in accordance with the first aspectof the present invention. Preferably one of said at least one layerdirectly coats said surface of the glass substrate such that there areno intervening layers. Preferably said layer based on an oxide of ametal or of a metalloid is deposited using CVD. When said surface iscoated with at least one layer based on an oxide of a metal or of ametalloid, and at least one layer based on a TCC and/or at least onelayer based on a material with a refractive index of at least 1.75, thefirst of said layers that is deposited on said surface may preferably bedeposited using CVD and at least one of the subsequently depositedlayers may preferably be deposited using PVD. When at least three layersare deposited on said surface of the substrate, preferably at least thefirst two layers that are deposited on said surface are deposited usingCVD.

Preferably the surface area of the outer surface of the layer furthestfrom the glass substrate is greater than the surface area of the outersurface of the layer furthest from the glass substrate of acorrespondingly coated glazing manufactured by the same method exceptthat step b) was omitted. Preferably the surface area of the outersurface of the layer furthest from the glass substrate is 2% greater,more preferably 5% greater, even more preferably 10% greater, mostpreferably 15% greater than the surface area of the outer surface of thelayer furthest from the glass substrate of a correspondingly coatedglazing manufactured by the same method except that step b) was omitted.

Preferably the surface area of said surface of the glass substrate isgreater after step b) than the surface area of said surface before stepb). Preferably the surface area of said surface of the glass substrateis 2% greater, more preferably 5% greater, even more preferably 10%greater, most preferably 15% greater after step b) than the surface areaof said surface before step b).

Preferably the acidic gas comprises one or more of a fluorine- orchlorine-containing acid such as HF and/or HCl, and/or phosphoric acid.The phosphoric acid may be derived from triethyl phosphite (TEP). Theacidic gas may further comprise water vapour, the presence of which canhelp control the etching process. The ratio of the volume of watervapour to the volume of acid in the acidic gas is preferably at least0.1, more preferably at least 0.5, even more preferably at least 1.0,most preferably at least 1.5, but preferably at most 40, more preferablyat most 30, even more preferably at most 20, most preferably at most 10.

The CVD may be carried out in conjunction with the manufacture of theglass substrate. In an embodiment, the glass substrate may be formedutilizing the well-known float glass manufacturing process. In thisembodiment, the glass substrate may also be referred to as a glassribbon. Conveniently the CVD etching of step b) or coating of step c)will be carried out either in the float bath, in the lehr or in the lehrgap. The preferred method of CVD is atmospheric pressure CVD (e.g.online CVD as performed during the float glass process). However, itshould be appreciated that the CVD process can be utilized apart fromthe float glass manufacturing process or well after formation andcutting of the glass ribbon.

The CVD may preferably be carried out when the glass substrate is at atemperature in the range 450° C. to 800° C., more preferably when theglass substrate is at a temperature in the range 550° C. to 700° C.Depositing a CVD coating when the glass substrate is at these preferredtemperatures affords greater crystallinity of the coating, which canimprove toughenability (resistance to heat treatment).

In certain embodiments, the CVD process is a dynamic process in whichthe glass substrate is moving at the time of etching or coating.Preferably, the glass substrate moves at a predetermined rate of, forexample, greater than 3.175 m/min during step b) and/or step c). Morepreferably the glass substrate is moving at a rate of between 3.175m/min and 12.7 m/min during step b) and/or step c).

As detailed above, preferably the CVD may be carried out during thefloat glass production process at substantially atmospheric pressure.Alternatively the CVD may be carried out using low-pressure CVD orultrahigh vacuum CVD. The CVD may be carried out using aerosol assistedCVD or direct liquid injection CVD. Furthermore, the CVD may be carriedout using microwave plasma-assisted CVD, plasma-enhanced CVD, remoteplasma-enhanced CVD, atomic layer CVD, combustion CVD (flame pyrolysis),hot wire CVD, metalorganic CVD, rapid thermal CVD, vapour phase epitaxy,or photo-initiated CVD. The glass substrate will usually be cut intosheets after deposition of the CVD coating(s) in step c) (and beforedeposition of any PVD coatings) for storage or convenient transport fromthe float glass production facility to a vacuum deposition facility.

The CVD may also comprise forming a gaseous mixture. As would beappreciated by those skilled in the art, the precursor compoundssuitable for use in the gaseous mixture should be suitable for use in aCVD process. Such compounds may at some point be a liquid or a solid butare volatile such that they can be vaporised for use in a gaseousmixture. Once in a gaseous state, the precursor compounds can beincluded in a gaseous stream and utilized in a CVD process to carry outsteps b) and/or c). For any particular combination of gaseous precursorcompounds, the optimum concentrations and flow rates for achieving aparticular etching/deposition rate and coating thickness may vary.

Preferably any steps carried out using CVD involve the preparation of aprecursor gas mixture. Preferably step b) is carried out using aprecursor gas mixture comprising HF and/or HCl, and water.Alternatively, step b) may be carried out using a precursor gas mixturecomprising phosphoric acid and/or TEP, wherein said precursor gasmixture may also comprise water.

The precursor gas mixture may further comprise a carrier gas ordiluents, for example, nitrogen, air and/or helium, preferably nitrogen.

For the deposition of SnO₂ via CVD the precursor gas mixture preferablycomprises dimethyl tin dichloride (DMT), oxygen and steam. The samemixture can be used to deposit SnO₂:F provided a source of flurorine isadded, such as HF. For the deposition of silica the precursor gasmixture may comprise silane (SiH₄) and ethylene (C₂H₄). For thedeposition of titania the precursor gas mixture may comprise titaniumtetrachloride (TiCl₄) and ethyl acetate (EtOAc). Preferably theprecursor gas mixtures comprise nitrogen. In some embodiments theprecursor gas mixture may also comprise helium.

Preferably the surface of the glass substrate that is etched and coatedis the gas side surface. Coated glass manufacturers usually preferdepositing coatings on the gas side surface (as opposed to the tin sidesurface for float glass) because deposition on the gas side surface canimprove the properties of the coating.

Preferably the PVD is carried out by sputter deposition. It isparticularly preferred that the PVD is magnetron cathode sputtering,either in the DC mode, in the pulsed mode, in the medium or radiofrequency mode or in any other suitable mode, whereby metallic orsemiconducting targets are sputtered reactively or non-reactively in asuitable sputtering atmosphere. Depending on the materials to besputtered, planar or rotating tubular targets may be used. The coatingprocess is preferably carried out by setting up suitable coatingconditions such that any oxygen (or nitrogen) deficit of any oxide (ornitride) layer of any layers of the coating is kept low to achieve ahigh stability of the visible light transmittance and colour of thecoated glazing, particularly during a heat treatment.

According to a third aspect of the present invention there is provided acoated glazing manufactured by the method according to the secondaspect.

According to a fourth aspect of the present invention there is providedthe use of an acidic gas to increase the haze exhibited by a coatedglazing comprising:

a) providing a transparent glass substrate,

b) etching a surface of the substrate with an acidic gas,

c) directly or indirectly coating said surface with at least one layerbased on a transparent conductive coating (TCC) and/or at least onelayer based on a material with a refractive index of at least 1.75.

According to a fifth aspect of the present invention there is providedthe use of a coated glazing according to the first or third aspect as ahorticultural glazing or as a component of a PV module, of an LED or ofan OLED.

According to a sixth aspect of the present invention there is provided aPV module incorporating the coated glazing according to the first orthird aspect.

According to a seventh aspect of the present invention there is providedan LED incorporating the coated glazing according to the first or thirdaspect.

According to an eighth aspect of the present invention there is providedan OLED incorporating the coated glazing according to the first or thirdaspect.

It will be appreciated that optional features applicable to one aspectof the invention can be used in any combination, and in any number.Moreover, they can also be used with any of the other aspects of theinvention in any combination and in any number. This includes, but isnot limited to, the dependent claims from any claim being used asdependent claims for any other claim in the claims of this application.

The reader's attention is directed to all papers and documents which arefiled concurrently with or previous to this specification in connectionwith this application and which are open to public inspection with thisspecification, and the contents of all such papers and documents areincorporated herein by reference.

All of the features disclosed in this specification (including anyaccompanying claims, abstract and drawings), and/or all of the steps ofany method or process so disclosed, may be combined in any combination,except combinations where at least some of such features and/or stepsare mutually exclusive.

Each feature disclosed in this specification (including any accompanyingclaims, abstract and drawings) may be replaced by alternative featuresserving the same, equivalent or similar purpose, unless expressly statedotherwise. Thus, unless expressly stated otherwise, each featuredisclosed is one example only of a generic series of equivalent orsimilar features.

The invention will now be further described by way of the followingspecific embodiments, which are given by way of illustration and not oflimitation:

EXAMPLES

All treatments and layer depositions were carried out using CVD. Theacidic gas treatments of the glass surface were all carried out onuncoated glass.

The Examples shown in Table 1 were conducted on a float line using a 3.2mm glass substrate, at a line speed of 14.4 m/min. The glass temperatureupstream of a coater A was 680.5° C.

For the uncoated samples, the glass surface treatment was carried outusing the following gas flows in coater A:

-   -   The “HF only” treatment consisted of 85 slm (standard litres per        minute) of N₂ gas and 10 slm of HF gas.    -   The “HCl only” treatment consisted of 85 slm of N₂ gas and 15        slm of HCl gas.    -   The “HCl+H₂O” treatment consisted of 10 slm of N₂ gas, 30 slm of        HCl gas, and 161 slm H₂O.

For the coated samples, the glass surface treatment was carried out(prior to coating) using similar gas flows in coater A:

-   -   The “HF only” treatment consisted of 85 slm of N₂ gas and 10 slm        of HF gas.    -   The “HCl only” treatment consisted of 85 slm of N₂ gas and 30        slm of HCl gas.    -   The “HCl+H₂O” treatment consisted of 25 slm of N₂ gas, 30 slm of        HCl gas, and 161 slm H₂O.

A SiO₂ layer (˜25 nm thick) was deposited over the treated glass surfaceusing coater B2 (downstream from A):

-   -   The gas flows for the silica deposition consisted of 370 slm of        N₂ carrier gas, 200 slm of He carrier gas, 27 slm of O₂, 32 slm        of C₂H₄, and 4.5 slm of SiH₄.

A SnO₂:F layer (˜330 nm thick) was deposited over the treated glasssurface using coaters C and D (next coaters downstream from B2):

-   -   The gas flows for coater C consisted of 140 slm of He carrier        gas, 230 slm of O₂, 31 pounds/hr dimethyltin dichloride, 12 slm        HF, and 322 slm H₂O.    -   The gas flows for coater D consisted of 140 slm of He carrier        gas, 230 slm of O₂, 31 pounds/hr dimethyltin dichloride, 15 slm        HF, and 267 slm H₂O.

The haze values of the samples were measured in accordance with the ASTMD 1003-61 standard.

TABLE 1 Percentage haze values exhibited by uncoated glass and coatedglass samples after treating the samples as shown. In accordance withthe present invention, the coated glass samples were treated duringtheir manufacture, prior to the deposition of the SiO₂ and SnO₂:Flayers. Haze (%) Coated Glass (Glass/ 25 nm SiO₂/330 nm Uncoated GlassSnO₂:F) Untreated 0.08 0.37 HF only 0.10 0.49 HCl only 0.16 3.36 HCl andH₂O 0.06 4.60

Table 1 shows that for the coated glass sample of the present invention,all of the treatments (carried out prior to coating) result in improvedhaze values in comparison with the untreated sample, and in comparisonwith the correspondingly treated uncoated samples. Moreover, the twotreatments that use HCl result in far higher haze values than the HFtreatment. The high haze achieved with the HCl treatments is even morepronounced when compared to the correspondingly treated uncoatedsamples.

The invention is not restricted to the details of the foregoingembodiments. The invention extends to any novel one, or any novelcombination, of the features disclosed in this specification (includingany accompanying claims, abstract and drawings), or to any novel one, orany novel combination, of the steps of any method or process sodisclosed.

1-25. (canceled)
 26. A coated glazing comprising: a transparent glasssubstrate, wherein a surface of the substrate is directly or indirectlycoated with at least one layer based on a transparent conductive coating(TCC) and/or at least one layer based on a material with a refractiveindex of at least 1.75, and wherein said surface has an arithmeticalmean height of the surface value, Sa, of at least 0.4 nm prior to saidcoating of said surface.
 27. The glazing according to claim 26, whereinsaid surface has an arithmetical mean height of the surface value, Sa,of at least 0.6 nm prior to said coating of said surface.
 28. Theglazing according to claim 26, wherein said glazing exhibits a haze ofat least 0.4%.
 29. The glazing according to claim 26, wherein the TCC isa transparent conductive oxide (TCO) and wherein the TCO is one or moreof fluorine doped tin oxide (SnO2:F), zinc oxide doped with aluminium,gallium or boron (ZnO:Al, ZnO:Ga, ZnO:B), indium oxide doped with tin(ITO), cadmium stannate, ITO:ZnO, ITO:Ti, In2O3, In2O3-ZnO (IZO),In2O3:Ti, In2O3:Mo, In2O3:Ga, In2O3:W, In2O3:Zr, In2O3:Nb, In2-2xMxSnxO3with M being Zn or Cu, ZnO:F, Zn0.9Mg0.1O:Ga, and (Zn,Mg)O:P, ITO:Fe,SnO2:Co, In2O3:Ni, In2O3:(Sn,Ni), ZnO:Mn, and ZnO:Co.
 30. The glazingaccording to claim 26, wherein each layer of the at least one layerbased on a TCC has a thickness of 100 nm, but at most 450 nm.
 31. Theglazing according to claim 26, wherein the material with a refractiveindex of at least 1.75 is one or more of SnO2, TiO2, and ZnO.
 32. Theglazing according to claim 26, wherein each layer of the at least onelayer based on a material with a refractive index of at least 1.75 has athickness of at least 50 nm, but at most 200 nm.
 33. The glazingaccording to claim 26, wherein the glazing further comprises at leastone layer based on an oxide selected from the group consisting of SiO2,SnO2, TiO2, silicon oxynitride and aluminium oxide.
 34. The glazingaccording to claim 33, wherein one layer of said at least one layerbased on an oxide of a metal or of a metalloid is located in directcontact with said surface of the glass substrate.
 35. The glazingaccording to claim 33, wherein each layer of the at least one layerbased on an oxide of a metal or of a metalloid has a thickness of atleast 10 nm, but at most 35 nm.
 36. The glazing according to claim 26,wherein the glazing is heat treatable.
 37. A method of manufacture of acoated glazing comprising the following steps in sequence: a) providinga transparent glass substrate, b) etching a surface of the substratewith an acidic gas, and c) directly or indirectly coating said surfacewith at least one layer based on a transparent conductive coating (TCC)and/or at least one layer based on a material with a refractive index ofat least 1.75.
 38. The method of manufacture of a coated glazingaccording to claim 37, wherein step b) is carried out using ChemicalVapour Deposition (CVD).
 39. The method of manufacture of a coatedglazing according to claim 37, wherein both steps b) and c) are carriedout using Chemical Vapour Deposition (CVD).
 40. The method ofmanufacture of a coated glazing according to claim 37, wherein step c)further comprises directly or indirectly coating said surface of theglass substrate with at least one layer based on an oxide of a metal orof a metalloid.
 41. The method of manufacture of a coated glazingaccording to claim 37, wherein the surface area of the outer surface ofthe layer furthest from the glass substrate is greater than the surfacearea of the outer surface of the layer furthest from the glass substrateof a correspondingly coated glazing manufactured by the same methodexcept that step b) was omitted.
 42. The method of manufacture of acoated glazing according to claim 37, wherein the acidic gas comprisesone or more of a fluorine- or chlorine-containing acid such as HF and/orHCl, and/or phosphoric acid.
 43. The method of manufacture of a coatedglazing according to claim 37, wherein the acidic gas further compriseswater vapour.
 44. The method of manufacture of a coated glazingaccording to claim 43, wherein the ratio of the volume of water vapourto the volume of acid in the acidic gas is at least 0.5 and at most 30.45. The method of manufacture of a coated glazing according to claim 43,wherein step b) is carried out using a precursor gas mixture comprisingHF and/or HCl, nitrogen and water.
 46. A coated glazing manufactured bythe method according to claim
 37. 47. A method of using an acidic gas toincrease the haze exhibited by a coated glazing comprising: a) providinga transparent glass substrate, b) etching a surface of the substratewith an acidic gas, and c) directly or indirectly coating said surfacewith at least one layer based on a transparent conductive coating (TCC)and/or at least one layer based on a material with a refractive index ofat least 1.75.
 48. A PV module incorporating the coated glazingaccording to claim
 26. 49. An LED incorporating the coated glazingaccording to claim
 26. 50. An OLED incorporating the coated glazingaccording to claim 26.